应用精密|APPLIED PRECISION
Call:
021-54886048
公司概况
COMPANY PROFILE
Applied Precision was founded in 1987 and is a leading manufacturer specializing in semiconductor packaging molds and production automation solutions. The company has subsidiaries in Shanghai, Huzhou, and Singapore, with a total global investment of 30 million US dollars, 160 professional employees, and obtained ISO9001 certification in 1996. The core business covers auto mold, MGP molds, automatic trim & form systems, as well as tin plating automation production lines. With advanced technology, the company serves major markets such as Singapore, Malaysia, Thailand, the Philippines, Indonesia, and China. Its clients include multinational semiconductor companies from the United States, Japan, and Europe, committed to improving global semiconductor manufacturing efficiency and quality.
core
Core

Technical advantages

Micro level precision manufacturing system, deeply rooted in the field of semiconductor packaging molds for 30 years, building a multi cavity synchronous injection molding technology covering mold design, micro level surface treatment, and independently developed to achieve ± 3 μ m molding accuracy

Global Service Network

Cross regional collaborative delivery center, with Shanghai as the Asia Pacific headquarters, linking Huzhou Intelligent Manufacturing Base and Singapore R&D Center to form a seamless "24-hour R&D production operation and maintenance" system. Relying on modular mold architecture and standardized process packages, we have achieved 48 hour emergency response in the Southeast Asian market and provided localized and fast delivery services to hundreds of semiconductor companies in six countries.
AP Singapore founded
1987
1996
ISO Certification
Develop mold RT-PIN
2010
AP Huzhou founded
2006
2022
First Auto MGP
MGP
30 years of MGP mold making

       SOT · TO · QFN · SIP · DIP · IGBT · IPM · SSOP etc
AMGP
首台工业自动塑封机
TRIM & FORM SYSTEM
高速同步凸轮自动化
HYDRAULIC PRESS
250t  & 150t
Corollary equipment
联系我们
Contact Us

Adhering to the business philosophy of "precision is our business", and with the motto of "quality is the vitality of the enterprise" and "customer satisfaction is our noble mission". We are grateful for the trust and support from our customers
Mobile
021-54886048
Email
ap@appsh.com.cn
Address 2199 Hongfeng West Road, Huzhou City, Zhejiang Province& C101, Building 3, No. 215 Shennan Road, Minhang District, Shanghai
我们能为您提供什么
WHAT CAN WE OFFER YOU
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LEAD PLATING
MOLDING COMPOUND
CLEANING RUBBER
HIGH SPEED PLATING LINE
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By adopting intelligent constant current control and high-speed transmission technology, the lead tin plating thickness accuracy is ± 1.5 μ m, the line speed reaches 12 meters/minute, the tin layer is uniform without oxidation, and the yield rate exceeds 99.5%. Fully automatic closed-loop control reduces manual intervention, adapts to the precision requirements of semiconductor packaging.
MOLDING COMPOUND
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Adopting a high-purity epoxy resin and nano filler composite system, it has low stress and high temperature resistance of 260 ℃, with a thermal conductivity of 2.5W/mK, and is suitable for advanced packaging processes. Precise pre molding design reduces overflow, improves chip protection reliability, complies with JEDEC standards, uses green and environmentally friendly materials, and helps 5G/automotive grade chip yield exceed 99.9%.
CLEANING RUBBER
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• High fluidity: easy to flow, fully filling the mold cavity; • Excellent mold cleaning ability: It has excellent infiltration and adsorption effects on the surface dirt of the mold; • Low odor and smoke emissions: Low smoke emissions during the solidification process, acceptable odor; • High curing strength: After curing, the film is easy to demold, not easily broken, and easy to operate.
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