As the pioneer of MGP molds and one of the first semiconductor packaging foreign companies rooted in China, we have been leading industry technological innovation for thirty years and building a strategic cooperation ecosystem with leading global plastic packaging factories. With a deep understanding of international standards for semiconductor packaging and multiple core patents, we have independently developed fully automatic MGP, achieving dual breakthroughs in unmanned production and 99.98% yield rate. We have established an industry talent incubation system, and through models such as school enterprise joint training and practical technical breakthroughs, we have transported over a hundred professional engineers to promote the construction of the industry talent pool. Continuously iterating technology with an annual R&D investment of 15%, completing the intelligent upgrade of three generations of molds, and compressing the investment return cycle to 8 months.